Technologies
Soldering
Soldering is a process to join two or more metal items together by melting and flowing a filler metal into the joint, the filler metal having a melting point below 400 °C (752 °F).
Anisotropic Conductive Film
Anisotropic Conductive Film (ACF), is a lead-free and environmentally-friendly interconnect system to make the electrical and mechanical connections between two components. ACFs have more recently been used to perform the flex-to-board or flex-to-flex connections used in LCDs, handheld electronic devices such as mobile phones, MP3 players, or in the assembly of CMOS camera modules.
Micro Resistance Welding
Micro resistance welding is used to join metals with similar grain structures where the heat to form the weld is generated by the resistance of the two materials when current is applied. The weld energy applied to the workpieces form a “nugget” alloy of the two materials with larger grain growth. The welded materials usually exhibit excellent tensile, peel and shear strengths.
Final Assembly Systems
C-Tech provides both the product and application experience in implementing complex automation solutions. C-tech offers a complete line of Final Assembly Systems and services including: development products, resources and technical support.