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Equipment and System Solutions

• - Hot-Bar Reflow Soldering
• - Other Reflow Systems
• - Thermodes

• - ACF Bonding
• - Heat Seal Bonding
• - Thermodes

• - AC/CD Welding Equipment
• - Micro Precision Welding
• - Micro Pulse Arc Systems
• - Precision Welding
• - Seam Welding Systems
• - Welding for Large Scale
• - Welding with Lasers

• - Lamination (Polarizers)
• - Laser Marking
• - Punches and Exise

Products

 

Soldering Solutions

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Hot Bar Soldering ♦ Point Reflow Soldering ♦ Inductive Soldering ♦ Resistance Soldering ♦ Robotic Soldering

 

Bonding Solutions

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ACF Bonding ♦ ACF Laminating (Tacking) ♦ Heat Seal Bonding ♦ TAB Bonding ♦ Anisotropic Conductive Film (ACF)

 

 

Welding Solutions

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Micro Resistance Welding ♦ Resistance Welding ♦ Laser Welding ♦ Automated Welding Systems

 

Assembly Solutions

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Laser Marking ♦ Dispense Systems ♦ Laminators ♦ Punching Systems ♦ Pick & Place ♦ Robot product handling ♦ Motion Control♦ Automatic Alignment, ♦Process and Product quality testing